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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S010T-1FG484I Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S010T 484-FPBGA (23x23) -
10AS022E3F27E2LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS027H3F34E2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S025T-VF400I Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
M2S060-1FG676 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
M2S050-1VF400 Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S050 400-VFBGA (17x17) -
10AS066K3F40I2LG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
1SX280LU2F50I2LG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
10AS016E4F29I3SG Intel® FPGAs IC SOC FPGA 288 I/O 780FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
M2S025-1VF400 Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S025 400-VFBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.