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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS016E4F29I3SG Intel® FPGAs IC SOC FPGA 288 I/O 780FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
M2S025-1VF400 Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S025 400-VFBGA (17x17) -
10AS066H2F34I2SGES Altera (Intel® Programmable Solutions Group) IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
XCZU19EG-2FFVE1924E Xilinx IC FPGA 668 I/O 1924FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1924-BBGA, FCBGA - 1924-FCBGA (45x45) -
10AS057K2F35I2SG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
XCZU19EG-1FFVC1760E Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
10AS027E4F27E3LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU17EG-1FFVD1760E Xilinx IC FPGA 308 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
5CSEBA2U23I7LN Intel® FPGAs 672-PIN UBGA - - - Tray - - - - -
10AS066K4F35I3SG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.