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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5ASXFB5H6F40C6N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXFB5 | 1517-FBGA (40x40) | - | |
| XCZU7CG-L1FFVF1517I | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| 10AS057K1F40E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| 5ASTFD5K3F40I3N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V ST | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASTFD5 | 1517-FBGA (40x40) | - | |
| 10AS032H3F35E2SG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| BCM3384ZUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - | |
| 5CSXFC6C6U23I7N | Altera (Intel® Programmable Solutions Group) | IC FPGA 145 I/O 672UBGA | Cyclone® V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 672-FBGA | 5CSXFC6 | 672-UBGA (23x23) | - | |
| XCZU7CG-2FFVF1517E | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| 10AS048H2F34E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| M2S050TS-FGG896 | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BGA | - | 896-FBGA (31x31) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.