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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5ASXFB5H6F40C6N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXFB5 1517-FBGA (40x40) -
XCZU7CG-L1FFVF1517I Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS057K1F40E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
5ASTFD5K3F40I3N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V ST -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASTFD5 1517-FBGA (40x40) -
10AS032H3F35E2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
BCM3384ZUKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
5CSXFC6C6U23I7N Altera (Intel® Programmable Solutions Group) IC FPGA 145 I/O 672UBGA Cyclone® V SX -40°C ~ 100°C (TJ) - Tray - 672-FBGA 5CSXFC6 672-UBGA (23x23) -
XCZU7CG-2FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS048H2F34E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S050TS-FGG896 Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 896-BGA - 896-FBGA (31x31) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.