• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai

Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
Manufacturer
Series
Operating Temperature
Packaging
Package / Case
Base Part Number
Supplier Device Package

Clear Filters

Loading products…

Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XC7Z015-3CLG485E Xilinx IC SOC CORTEX-A9 ARTIX-7 485BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 485-CSBGA (19x19) -
5ASXBB3D4F40C4N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXBB3 1517-FBGA (40x40) -
M2S060TS-1FCSG325I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S060T-1FGG676I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
M2S060TS-FCSG325 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S050-VF400 Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S050 400-VFBGA (17x17) -
XC7Z045-2FFG676E Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -
XCZU11EG-1FFVB1517I Xilinx IC FPGA 488 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS066N2F40E2LG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
1SX280LN3F43I3VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.