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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU5EG-1SFVC784I | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| M2S050TS-FGG896I | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BGA | - | 896-FBGA (31x31) | - | |
| XC7Z007S-2CLG225E | Xilinx | IC FPGA SOC 100I/O 225BGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 225-LFBGA, CSPBGA | - | 225-CSPBGA (13x13) | - | |
| 10AS057K2F35I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | |
| XC7Z010-1CLG400I | Xilinx | IC SOC CORTEX-A9 ARTIX-7 400BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA, CSPBGA | XC7Z010 | 400-CSPBGA (17x17) | - | |
| A2F060M3E-1TQG144I | Microsemi | IC FPGA 60K GATES 128KB 144-TQFP | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | - | |
| XCZU9CG-1FFVC900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| XCZU7EV-1FFVF1517I | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EV | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S010T-1FG484I | Microsemi | IC FPGA SOC 10K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | M2S010T | 484-FPBGA (23x23) | - | |
| 10AS022E3F27E2LG | Intel® FPGAs | 672-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.