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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S005-1FG484I | Microsemi | IC FPGA SOC 5K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | M2S005 | 484-FPBGA (23x23) | - | |
| XCZU6EG-2FFVC900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| XCZU5EG-L2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| XCZU6CG-1FFVB1156E | Xilinx | XCZU6CG-1FFVB1156E | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| XC7Z035-L2FFG676I | Xilinx | IC SOC CORTEX-A9 KINTEX7 676BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | - | 676-FCBGA (27x27) | - | |
| M2S150-1FCSG536 | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 536-LFBGA | - | 536-BGA (16x16) | - | |
| XA7Z020-1CLG400Q | Xilinx | IC SOC CORTEX A-9 ZYNQ7 400BGA | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 125°C (TJ) | - | Tray | - | 400-LFBGA, CSPBGA | - | 400-CSPBGA (17x17) | - | |
| XC7Z014S-1CLG484I | Xilinx | IC FPGA SOC 200I/O 484BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-LFBGA, CSPBGA | - | 484-CSPBGA (19x19) | - | |
| 5CSEMA5U23C7N | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSEMA5 | 672-UBGA (23x23) | - | |
| 10AS057K1F35I1HG | Intel® FPGAs | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.