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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S005-1FG484I Microsemi IC FPGA SOC 5K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S005 484-FPBGA (23x23) -
XCZU6EG-2FFVC900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU5EG-L2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
XCZU6CG-1FFVB1156E Xilinx XCZU6CG-1FFVB1156E Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XC7Z035-L2FFG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
M2S150-1FCSG536 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 536-LFBGA - 536-BGA (16x16) -
XA7Z020-1CLG400Q Xilinx IC SOC CORTEX A-9 ZYNQ7 400BGA Automotive, AEC-Q100, Zynq®-7000 XA -40°C ~ 125°C (TJ) - Tray - 400-LFBGA, CSPBGA - 400-CSPBGA (17x17) -
XC7Z014S-1CLG484I Xilinx IC FPGA SOC 200I/O 484BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 484-CSPBGA (19x19) -
5CSEMA5U23C7N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEMA5 672-UBGA (23x23) -
10AS057K1F35I1HG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.