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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS066N1F40E1HG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
XCZU3EG-1SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
XCZU6EG-1FFVC900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S050T-FG484 Microsemi IC FPGA SOC 50K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S050T 484-FPBGA (23x23) -
M2S150TS-1FCVG484I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BFBGA - 484-BGA -
10AS048E1F29E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 360 I/O 780FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
5CSEBA5U19I7SN Intel® FPGAs IC FPGA 66 I/O 484UBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 484-FBGA 5CSEBA5 484-UBGA (19x19) -
1SX280LU2F50E2LG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S100T-FC1152 Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100T 1152-FCBGA (35x35) -
A2F500M3G-FG256I Microsemi IC FPGA 500K GATES 512KB 256-BGA SmartFusion® -40°C ~ 100°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FPBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.