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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10AS066N1F40E1HG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - | |
| XCZU3EG-1SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| XCZU6EG-1FFVC900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| M2S050T-FG484 | Microsemi | IC FPGA SOC 50K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S050T | 484-FPBGA (23x23) | - | |
| M2S150TS-1FCVG484I | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BFBGA | - | 484-BGA | - | |
| 10AS048E1F29E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 360 I/O 780FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - | |
| 5CSEBA5U19I7SN | Intel® FPGAs | IC FPGA 66 I/O 484UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | - | Tray | - | 484-FBGA | 5CSEBA5 | 484-UBGA (19x19) | - | |
| 1SX280LU2F50E2LG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| M2S100T-FC1152 | Microsemi | IC FPGA SOC 100K LUTS 1152FCBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S100T | 1152-FCBGA (35x35) | - | |
| A2F500M3G-FG256I | Microsemi | IC FPGA 500K GATES 512KB 256-BGA | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 256-LBGA | A2F500M3G | 256-FPBGA (17x17) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.