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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU11EG-1FFVB1517I Xilinx IC FPGA 488 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS066N2F40E2LG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
1SX280LN3F43I3VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XCZU4EG-L2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
1SX280LH2F55E1VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU2EG-L2SBVA484E Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
XC7Z030-2FBG676E Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z030 676-FCBGA (27x27) -
M2S050T-1FGG484M Microsemi IC FPGA SOC 50K LUTS 484FBGA SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
XCZU7EV-2FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU3EG-2SFVA625E Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.