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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEBA4U23C8SN Altera (Intel® Programmable Solutions Group) IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
XCZU9EG-L2FFVC900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU15EG-2FFVC900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
1SX250LN3F43I3VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XC7Z035-3FFG676E Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
10AS057H2F34I1HG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU4CG-1SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
M2S025S-1VF400I Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S025S 400-VFBGA (17x17) -
M2S150TS-1FCV484I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BFBGA - 484-BGA -
10AS027E1F29E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 360 I/O 780FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.