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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S050S-1VFG400I | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | M2S050S | 400-VFBGA (17x17) | - | |
| M2S010-1TQG144I | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - | |
| 10AS057N1F40I1HG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - | |
| XCZU11EG-L1FFVC1760I | Xilinx | IC FPGA 512 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - | |
| 5ASXMB3E4F31C4N | Intel® FPGAs | IC FPGA 170 I/O 896FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BBGA, FCBGA | 5ASXMB3 | 896-FBGA (31x31) | - | |
| 10AS057N3F40I2LG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| XCZU3EG-2SBVA484E | Xilinx | IC FPGA 82 I/O 484FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | - | 484-FCBGA (19x19) | - | |
| XCZU15EG-L1FFVB1156I | Xilinx | IC FPGA 328 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| 10AS066K2F40E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - | |
| 5CSEBA6U23C7SN | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSEBA6 | 672-UBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.