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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XA7Z010-1CLG400I Xilinx IC SOC CORTEX A-9 ZYNQ7 400BGA Automotive, AEC-Q100, Zynq®-7000 XA -40°C ~ 100°C (TJ) - Tray - 400-LFBGA, CSPBGA - 400-CSPBGA (17x17) -
10AS027E1F29E1HG Intel® FPGAs IC SOC FPGA 360 I/O 780FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
XC7Z030-2FFG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z030 676-FCBGA (27x27) -
XC7Z045-1FBG676CES Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -
M2S005S-VF256 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
XC7Z030-2FBG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z030 676-FCBGA (27x27) -
10AS022E3F29E2LG Intel® FPGAs 780-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XC7Z010-L1CLG225I Xilinx IC SOC CORTEX-A9 ARTIX7 225BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 225-LFBGA, CSPBGA - 225-CSPBGA (13x13) -
M2S025T-FGG484 Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S025T 484-FPBGA (23x23) -
XC7Z014S-2CLG484I Xilinx IC FPGA SOC 200I/O 484BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 484-CSPBGA (19x19) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.