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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEMA5F31C8N Intel® FPGAs IC FPGA 288 I/O 896FBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSEMA5 896-FBGA (31x31) -
M2S025S-1FGG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S025S 484-FPBGA (23x23) -
XCZU4EV-L2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
10AS048E3F29E2SG Intel® FPGAs 780-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU2CG-L2SBVA484E Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
10AS032H4F35E3SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S090TS-FG484 Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S010S-TQG144I Microsemi IC FPGA SOC SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - - - - -
10AS032E1F27E1HG Intel® FPGAs IC SOC FPGA 240 I/O 672FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
5ASXBB5D4F31C5N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 896-BBGA, FCBGA 5ASXBB5 896-FBGA (31x31) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.