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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEBA4U19I7LN Intel® FPGAs 484-PIN UBGA - - - Tray - - - - -
A2F200M3F-CS288 Microsemi IC FPGA 200K GATES 256KB 288-CSP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 288-TFBGA, CSPBGA A2F200 288-CSP (11x11) -
XCZU4EV-L1FBVB900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S025T-FG484 Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S025T 484-FPBGA (23x23) -
XC7Z020-1CLG484CES Xilinx IC SOC CORTEX-A9 ARTIX-7 484BGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 484-LFBGA, CSPBGA XC7Z020 484-CSPBGA (19x19) -
XCZU17EG-2FFVD1760E Xilinx IC FPGA 308 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
10AS057N2F40E2LG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S050T-1FG896 Microsemi IC FPGA SOC 50K LUTS 896FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 896-FBGA M2S050T 896-FBGA (31x31) -
XCZU11EG-1FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU7CG-1FFVC1156I Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.