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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5CSEBA4U19I7LN | Intel® FPGAs | 484-PIN UBGA | - | - | - | Tray | - | - | - | - | - | |
| A2F200M3F-CS288 | Microsemi | IC FPGA 200K GATES 256KB 288-CSP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F200 | 288-CSP (11x11) | - | |
| XCZU4EV-L1FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EV | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| M2S025T-FG484 | Microsemi | IC FPGA SOC 25K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S025T | 484-FPBGA (23x23) | - | |
| XC7Z020-1CLG484CES | Xilinx | IC SOC CORTEX-A9 ARTIX-7 484BGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-LFBGA, CSPBGA | XC7Z020 | 484-CSPBGA (19x19) | - | |
| XCZU17EG-2FFVD1760E | Xilinx | IC FPGA 308 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - | |
| 10AS057N2F40E2LG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S050T-1FG896 | Microsemi | IC FPGA SOC 50K LUTS 896FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 896-FBGA | M2S050T | 896-FBGA (31x31) | - | |
| XCZU11EG-1FFVF1517E | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| XCZU7CG-1FFVC1156I | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.