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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XC7Z045-1FFG900CES Xilinx IC SOC CORTEX-A9 KINTEX7 900FBGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 900-BBGA, FCBGA XC7Z045 900-FCBGA (31x31) -
5CSEBA5U19C8N Intel® FPGAs IC FPGA 66 I/O 484UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 484-FBGA 5CSEBA5 484-UBGA (19x19) -
M2S010TS-VFG400 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
XCZU4EV-2FBVB900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
10AS016E3F27E2LG Intel® FPGAs IC SOC FPGA 240 I/O 672FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
XCZU7EV-1FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S010T-1FG484M Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S050T-1FGG896I Microsemi IC FPGA SOC 50K LUTS 896FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 896-FBGA M2S050T 896-FBGA (31x31) -
M2S090TS-1FCSG325I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S010-1VFG400I Microsemi IC FPGA SOC 10K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S010 400-VFBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.