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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S010T-VF256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
M2S010T-VF256 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
XCZU19EG-1FFVD1760I Xilinx IC FPGA 308 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
XC7Z014S-1CLG484C Xilinx IC FPGA SOC 200I/O 484BGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 484-LFBGA, CSPBGA - 484-CSPBGA (19x19) -
5CSEBA5U23C6N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEBA5 672-UBGA (23x23) -
XC7Z035-L2FBG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
M2S060-FCS325I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
10AS057N4F40I3SG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS032E4F27E3SG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
5CSEBA6U19C6N Intel® FPGAs IC FPGA 66 I/O 484UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 484-FBGA 5CSEBA6 484-UBGA (19x19) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.