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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0725-03-100-2C | Trenz Electronic | SOM ARTIX-7 100T FLASH 2C | TE0725 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0712-02-100-2C | Trenz Electronic | SOM ARTIX-7 XC7A100T-2C 1GB DDR3 | TE0712 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0841-01-035-2I | Trenz Electronic | SOM USCALE XCKU035-2I 1GB DDR4 | TE0841 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-9M-QA25-Z1-B | Digi International | MOD 9M 32MB SDRAM 32MB FLASH 25 | ConnectCore® | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0741-03-160-2IF | Trenz Electronic | SOM KINTEX-7 160T 32MB FLASH AES | TE0741 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
SOMDM3730-31-2880AKXR | Logic PD, Inc. | SOM TORPEDO WIRELESS DM3730 1GHZ | DM37x | -40°C ~ 70°C | - | - | - | - | - | - | - |
|
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CENGLH7A400-10-403EI | Logic PD, Inc. | CARD ENGINE 16MB FLASH 32MB RAM | - | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0715-04-15-2I | Trenz Electronic | SOM SOC 7Z015-2CLG485I 1GB DDR3 | TE0715 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CENGPXA270-416-11-505EXR | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | -25°C ~ 85°C | - | - | - | - | - | - | - |
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|
101-0675 | Digi International | MODULE RABBITCORE RCM3710 | RabbitCore® | 0°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.