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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SOMDM3730-30-1880AKIR | Logic PD, Inc. | SYSTEM ON MODULE TORP | DM37x | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-1328 | Digi International | RCM3710 W/MOUNTING HOLES | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
|
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CENGPXA270-416-10-550HIR | Logic PD, Inc. | CARD ENGING 64MB SDRAM | - | -40°C ~ 85°C | - | - | - | - | - | - | - |
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EC-V-H264-8B-60-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD VID ENCODER 8BIT 60FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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CC-7U-Z113-Z1 | Digi International | MODULE 7U 16MB SDRAM 8MB FLASH | ConnectCore® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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MOD54415-100IR | NetBurner, Inc. | MOD54415 ETHERNET CORE MODULE | - | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0714-01-35-2I | Trenz Electronic | SOM ARTIX7 XC7A35T-2CSG325I 2I | TE0714 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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EC-VA-H264-10B-30-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD A/V ENCODR 10BIT 30FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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20-101-0081 | Digi International | CORE MODULE CM7100 | CM7000 | -40°C ~ 70°C | - | - | - | - | - | - | - |
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20-101-1028 | Digi International | MODULE RABBITCORE RCM3750 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.