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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
20-101-0955 | Digi International | MODULE RABBITCORE RCM2260 ROHS | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0782-02-100-2I | Trenz Electronic | SOM ZYNQ XC7Z100-2I 1GB DDR3 | TE0782 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CENGSH7760-10-503HC | Logic PD, Inc. | CARD ENGINE 16MB FLASH 64MB RAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-Y413-C | Digi International | MOD ME 9210 16MB SDRAM 8MB FLASH | Digi Connect ME® | -40°C ~ 80°C | - | - | - | - | - | - | - |
|
MOD5270BXME | NXP Semiconductors / Freescale | MOD NETBURNER MOD5270 100 UNITS | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-JT | Digi International | MODULE ME CUSTOMIZABLE JTAG | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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EZ80F916005MODG | Zilog | MODULE EZ80F91 512K 50MHZ | eZ80® Acclaim!® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-MF | Digi International | MODULE ME 8MB SDRAM 2MB FLASH | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9P-T237-Z1 | Digi International | MODULE 9P 64MB SDRAM 128MB FLASH | ConnectCore® | - | - | - | - | - | - | - | - |
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CC-9C-V226-ZA | Digi International | MODULE 9C 32MB SDRAM 64MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.