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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BS2PX24 | Parallax, Inc. | MODULE BASIC STAMP 2PX24 | BASIC Stamp® | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CC-7U-Z111-Z1 | Digi International | MODULE 7U 16MB SDRAM 2MB FLASH | ConnectCore® | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CC-MX-LB6B-ZM-B | Digi International | MODULE I.MX51 2GB FLASH 25PK | ConnectCore® | - | - | - | - | - | - | - | - |
|
101-0950 | Digi International | MODULE RABBITCORE RCM3370 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
|
CENGPXA270-520-10-504HCR | Logic PD, Inc. | CARD ENGINE 32MB FLASH 64MB RAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0725-02-100-2C | Trenz Electronic | SOM ARTIX-7 100T FLASH 2C | TE0725 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0728-03-1Q | Trenz Electronic | SOM XA7Z020-1CLG484Q 512MB CAN | TE0728 | - | - | - | - | - | - | - | - |
|
TE0803-01-03CG-1EA | Trenz Electronic | SOM USCALE+ XCZU3CG-1S 2GB DDR4 | - | - | - | - | - | - | - | - | - |
|
CENGLH7A404-11-504HC-B | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
MOD5270BXXE | NXP Semiconductors / Freescale | MOD NETBURNER MOD5270 10 UNITS | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.