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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DC-VA-H264-10B-60-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD A/V DECODR 10BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-9P-V502-ZA-C | Digi International | MODULE 9P 8MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
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CC-9P-V527UJ-S | Digi International | MOD 9P 32MB SDRAM 8MB FLASH | ConnectCore® | - | - | - | - | - | - | - | - |
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20-101-1112 | Digi International | MODULE RABBITCORE RCM4010 | RabbitCore® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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MOD5270BXCE | NXP Semiconductors / Freescale | MOD NETBURNER MOD5270 100 UNITS | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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EDM1-IMX6QP-MSD-BW | Wandboard | EDM1-IMX6QP-MSD-BW SOM 10PK | - | - | - | - | - | - | - | - | - |
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SOMXOMAPL138-10-1502QHCR | Logic PD, Inc. | SYSTEM ON MODULE LP OMAPL138 | OMAP-L138 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CC-9C-V212-Z6 | Digi International | MODULE 9C 16MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DC-ME-Y402-NC | Digi International | MOD ME 9210 8MB SDRAM 4MB FLASH | Digi Connect ME® | -40°C ~ 80°C | - | - | - | - | - | - | - |
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DC-SP-01-C-25 | Digi International | ADAPTER SP CUSTOMIZABLE MODEL | Digi Connect SP | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.