Invent, Innovate, Integrate
- info@zenkaeurope.com
-
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
- Products
- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
Manufacturer
Series
Operating Temperature
Manufacturer Part Number
Clear Filters
Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
3352-HX-X38-RC | Critical Link | MITYSOM-3352 W/ AM3352 | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-VA-H264-8B-60-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD A/V DECODER 8BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0720-03-1CFA | Trenz Electronic | SOC MODULE 1GB DDR3 | TE0720 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
SOMDM3730-31-2780AKCR | Logic PD, Inc. | SYSTEM ON MODULE WIRELESS TORP | DM37x | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-ME-01T-S-50 | Digi International | ME 8MB SDRAM 2MB FLASH 50 PACK | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-1179 | Digi International | MODULE RABBITCORE RCM3209 | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
A13-SOM-512 | Olimex | SYSTEM ON CHIP MODULE, WITH A13 | - | - | - | - | - | - | - | - | - |
|
CENPXA270-HLR01-0708R-A | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | - | - | - | - | - | - | - | - |
|
DC-ME-01T-STL | Digi International | MODULE DIGI CONNECT ME | - | - | - | - | - | - | - | - | - |
|
DXLH5290I | DAVE Embedded Systems | SYSTEM ON MODULE I.MX6 2GB DDR3 | AXEL LITE | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.