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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CC-9P-V524-DSA | Digi International | CONNECTCORE 9P | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
DC-VA-H264-10B-60-1080-MXC-ZL | SOC Technologies (System-On-Chip Technologies) | MOD A/V DECODR 10BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0745-02-45-1CA | Trenz Electronic | SOM ZYNQ 1GB DDR3 | TE0745 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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SOMOMAP3530-21-1780AGIR | Logic PD, Inc. | SYSTEM ON MODULE LV OMAP3530 | OMAP35x | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0741-03-070-2CF | Trenz Electronic | SOM KINTEX-7 70T 32MB FLASH AES | TE0741 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0745-02-35-1C | Trenz Electronic | SOM MIT XILINX ZYNQ XC7Z035-1FBG | TE0745 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
XPDNC200S-01 | Lantronix | XPORT DIRECT PLUS DEVICE NETWORK | - | - | - | - | - | - | - | - | - |
|
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CC-9C-V237-Z1 | Digi International | MODULE 9C 64MB SDRAM 128MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0745-02-30-1IA | Trenz Electronic | SOM DDR3 1GB ZYNQ | TE0745 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
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DC-ME4-01T-CC-1 | Digi International | MODULE CONNECTCORE | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.