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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BS2-IC | Parallax, Inc. | BASIC STAMP II MODULE | BASIC Stamp® | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0741-03-325-2IF | Trenz Electronic | SOM KINTEX-7 325T 32MB FLASH AES | TE0741 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0729-02-2IF-K | Trenz Electronic | SOM ZYNQ XC7Z020-2I 512MB RTC | TE0729 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
SOMOMAP3530-21-1670AGCR | Logic PD, Inc. | SYSTEM ON MODULE LV OMAP3530 | OMAP35x | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
100-1500-1 | Bluetechnix GmbH | MODULE QSEVEN-I.MX537 | i.MX | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
101-0561 | Digi International | MODULE RABBITCORE RCM3400 W/AD | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-9P-V524-LX | Digi International | MODULE 9P 32MB SDRAM 16MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
5CSX-H6-4YA-RC | Critical Link | MITYSOM-5CSX W/ ALTERA CYCLONE V | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
FS-355 | Digi International | MODULE 7U 16MB SDRAM 2MB FLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CENGPXA270-312-10-440EC | Logic PD, Inc. | CARD ENGINE 32MB FLASH 32MB RAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.