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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FS-383 | Digi International | MODULE 9P 64MB SDRAM 64MB FLASH | - | - | - | - | - | - | - | - | - |
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M5475BFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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TE0841-02-040-1C | Trenz Electronic | SOM USCALE XCKU040-1S 1GB DDR4 | - | - | - | - | - | - | - | - | - |
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CENGLH7A400-10-504HC-C | Logic PD, Inc. | CARD ENGINE 64MB SDRAM 32MBFLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-NS | Digi International | MODULE ME 8MB SDRAM 2MB FLASH | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0600-02B | Trenz Electronic | SOM GIGABEE XC6SLX100 2X128MB 2I | TE0600 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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FS-3013 | Digi International | MODULE 9P 32MB SDRAM 32MB FLASH | - | - | - | - | - | - | - | - | - |
|
DLP-HS-FPGA3 | DLP Design, Inc. | MODULE USB-TO-FPGA SPARTAN 3A | FPGA | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-V-H264-10B-30-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODR 10BIT 30FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9P-V502-ZA-C-B | Digi International | MODULE 9P 8MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.