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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
101-0672 | Digi International | MODULE RABBITCORE RCM3600 | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
EC-V-H264-10B-60-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD VID ENCODR 10BIT 60FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
|
5CSX-H5-4YA-RI | Critical Link | MITYSOM-5CSX W/ ALTERA CYCLONE V | MitySOM | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
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CC-MX-MB6B-SLB | Digi International | CONNECTCORE | - | - | - | - | - | - | - | - | - |
|
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CC-9M-NA26-Z1-B | Digi International | MOD 9M 32MB SDRAM 64MB FLSH 25PK | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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FS-352 | Digi International | MODULE 7U 16MB SDRAM 8MB FLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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6711-AB-3X3-RC | Critical Link | DSP-XM SOM TMS320C6711 200MHZ | MityDSP-XM | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-V-H264-10B-30-1080-MXC-ZL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODR 10BIT 30FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9P-V524-LX-B | Digi International | MOD 9P 32MB SDRAM 16MB FLSH 25PK | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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|
CC-9C-V212-NC | Digi International | MODULE 9C 16MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.