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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XPP1002000-02R | Lantronix | XPORT PRO EXTENDED SRAM, EXTENDE | - | - | - | - | - | - | - | - | - |
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FS-325 | Digi International | MODULE DIMM520 16MB FLASH | - | - | - | - | - | - | - | - | - |
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CC-MX-LB47-ZM-B | Digi International | MODULE I.MX51 128MB FLASH 25PK | ConnectCore® | - | - | - | - | - | - | - | - |
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TE0820-02-03CG-1EA | Trenz Electronic | SOM USCALE+ XCZU3CG-1S 1GB DDR4 | - | - | - | - | - | - | - | - | - |
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20-101-1105 | Digi International | MODULE RCM4100 RABBITCORE | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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SOMOMAPL138-10-1602QHIR | Logic PD, Inc. | SYSTEM ON MODULE LV OMAPL138 | OMAP-L138 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0715-04-12S-1C | Trenz Electronic | SOM ZYNQ Z-7012S 1GB DDR3L SDRAM | TE0715 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-MF-VS | Digi International | MOD ME 8MB SDRAM 2MB FLASH | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DC-ME-01T-STL-1 | Digi International | MODULE DIGI CONNECT ME | - | - | - | - | - | - | - | - | - |
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DC-V-H264-10B-30-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODR 10BIT 30FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.