Invent, Innovate, Integrate
- info@zenkaeurope.com
-
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
- Products
- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
Manufacturer
Series
Operating Temperature
Manufacturer Part Number
Clear Filters
Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
20-101-1131 | Digi International | MODULE RCM4200 RABBITCORE | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
3354-GX-X38-RC | Critical Link | MODULE MITYSOM-335X | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
FS-335 | Digi International | MODULE MOD520C 2MB FLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
|
CC-MX-JN7A-Z1 | Digi International | CONNECTCORE I.MX6UL SOM | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
SOMDM3730-30-2780AKCR | Logic PD, Inc. | SYSTEM ON MODULE TORP+ DM3730 | DM37x | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
XPD1001000-01 | Lantronix | XPORT DIRECT+ DEVICE SERVER MODU | - | - | - | - | - | - | - | - | - |
|
|
CC-MX-PE47-MQ-1 | Digi International | MODULE CONNECTCORE I.MX280 | - | - | - | - | - | - | - | - | - |
|
|
CENGLH79524-10-403HCR | Logic PD, Inc. | CARD ENGINE 16MB FLASH 32MB RAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
|
FS-372 | Digi International | MODULE 32MB SDRAM 32MB FLASH | - | -25°C ~ 75°C | - | - | - | - | - | - | - |
|
XPP1002000-02R | Lantronix | XPORT PRO EXTENDED SRAM, EXTENDE | - | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.