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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
101-0673 | Digi International | MODULE RABBITCORE RCM3610 | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
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20-101-0078 | Digi International | CORE MODULE CM7130 | CM7000 | -40°C ~ 70°C | - | - | - | - | - | - | - |
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TE0712-02-200-2C | Trenz Electronic | SOM ARTIX-7 XC7A200T-2C 1GB DDR3 | TE0712 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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TE0741-02-070-2CF | Trenz Electronic | SOM KINTEX-7 70T 32MB FLASH AES | TE0741 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-CLI | Digi International | MODULE ME 8MB SDRAM 2MB FLASH | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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EC-V-H264-10B-30-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD VID ENCODR 10BIT 30FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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SOMDM3730-31-1780AKIR | Logic PD, Inc. | SYSTEM ON MODULE WIRELESS TORP | DM37x | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0711-01-100-2C | Trenz Electronic | SOM ARTIX-7 HIGH IO 100T USB 2C | TE0711 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-PS-50 | Digi International | MOD ME 8MB SDRAM 2MB FLSH 50PCK | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9C-V237-Z6-B | Digi International | MODULE 9C 64MB SDRAM 128MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.