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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CENGLH7A400-10-402EC | Logic PD, Inc. | CARD ENGINE 32MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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M5475JFEE | Logic PD, Inc. | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-Y402-MF-B | Digi International | MOD ME 8MB SDRAM 4MB FLASH 25P | Digi Connect ME® | -40°C ~ 80°C | - | - | - | - | - | - | - |
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CC-9M-NA37-Z1 | Digi International | MOD 9M 64MB SDRAM 128MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DLP-2232PB-G | DLP Design, Inc. | MODULE USB-MCU FT2232D W/16F877A | USB | - | - | - | - | - | - | - | - |
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SOMDM3730-32-2780AKCR | Logic PD, Inc. | SOM TORPEDO WIRELESS 1GHZ COM | DM37x | 0°C ~ 70°C | - | - | - | - | - | - | - |
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100-1215-1 | Bluetechnix GmbH | MODULE ECM-BF561-C-I-Q25S128F32 | Blackfin® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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FS-383 | Digi International | MODULE 9P 64MB SDRAM 64MB FLASH | - | - | - | - | - | - | - | - | - |
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M5475BFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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TE0841-02-040-1C | Trenz Electronic | SOM USCALE XCKU040-1S 1GB DDR4 | - | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.