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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SOMDM3730-31-1780AKIR | Logic PD, Inc. | SYSTEM ON MODULE WIRELESS TORP | DM37x | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0711-01-100-2C | Trenz Electronic | SOM ARTIX-7 HIGH IO 100T USB 2C | TE0711 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-ME-01T-PS-50 | Digi International | MOD ME 8MB SDRAM 2MB FLSH 50PCK | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-9C-V237-Z6-B | Digi International | MODULE 9C 64MB SDRAM 128MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-1131 | Digi International | MODULE RCM4200 RABBITCORE | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
3354-GX-X38-RC | Critical Link | MODULE MITYSOM-335X | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
|
FS-335 | Digi International | MODULE MOD520C 2MB FLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
|
CC-MX-JN7A-Z1 | Digi International | CONNECTCORE I.MX6UL SOM | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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SOMDM3730-30-2780AKCR | Logic PD, Inc. | SYSTEM ON MODULE TORP+ DM3730 | DM37x | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
XPD1001000-01 | Lantronix | XPORT DIRECT+ DEVICE SERVER MODU | - | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.