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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0741-02-070-2IF | Trenz Electronic | SOM KINTEX-7 70T 32MB FLASH AES | TE0741 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
M5485DFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0320-00-EV02B | Trenz Electronic | SOM SPARTAN-3A 3400K 1333MB DDR | TE0320 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-ME-Y402-LX-B | Digi International | ME 9210 8MB RAM 4MB FLASH LINUX | Digi Connect ME® | -40°C ~ 80°C | - | - | - | - | - | - | - |
|
CENGPXA270-312-10-550ECR | Logic PD, Inc. | CARD ENGINE 64MB SDRAM 64MB NAND | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CENGLH7A404-11-503HC | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
BS2E-IC | Parallax, Inc. | BASIC STAMP 2E MODULE | BASIC Stamp® | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-VA-H264-8B-60-1080-MXC-ZL | SOC Technologies (System-On-Chip Technologies) | MOD A/V DECODER 8BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
|
|
DC-V-H264-8B-30-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODER 8BIT 30FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
|
DLP-HS-FPGA2 | DLP Design, Inc. | MODULE USB ADAPTER FOR FT2232H | FPGA | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.