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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BS2E-IC | Parallax, Inc. | BASIC STAMP 2E MODULE | BASIC Stamp® | 0°C ~ 70°C | - | - | - | - | - | - | - | |
| DC-VA-H264-8B-60-1080-MXC-ZL | SOC Technologies (System-On-Chip Technologies) | MOD A/V DECODER 8BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - | |
| DC-V-H264-8B-30-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODER 8BIT 30FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - | |
| DLP-HS-FPGA2 | DLP Design, Inc. | MODULE USB ADAPTER FOR FT2232H | FPGA | - | - | - | - | - | - | - | - | |
| CC-MX-L76C-Z1-1 | Digi International | MOD WI-I.MX6 | ConnectCore® 6 | -40°C ~ 85°C | - | - | - | - | - | - | - | |
| CENGLH7A400-10-403EC | Logic PD, Inc. | CARD ENGINE 16MB FLASH 32MB RAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - | |
| DC-EM-02T-C | Digi International | EM 8MB SDRAM 4MB FLASH SINGLE | Digi Connect EM® | -40°C ~ 85°C | - | - | - | - | - | - | - | |
| 101-1087 | Digi International | MODULE RABBITCORE RCM 3365 | RabbitCore® | 0°C ~ 70°C | - | - | - | - | - | - | - | |
| MOD5270-100IR | NetBurner, Inc. | ETHERNET JACK PROCESSOR MODULE | - | -40°C ~ 85°C | - | - | - | - | - | - | - | |
| 101-0518 | Digi International | MODULE RABBITCORE RCM3110 | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.