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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DC-ME4-01T-S-10 | Digi International | DIGI CONNECT 4MB FLASH 8MB RAM | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0630-01IBF | Trenz Electronic | SOM SPARTAN-6 1GB DDR3 | TE0630 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-MX-L76C-Z1 | Digi International | MOD WI-I.MX6 50 PCS PACK | ConnectCore® 6 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9C-V223-RJ-25 | Digi International | MODULE | - | - | - | - | - | - | - | - | - |
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1810-DG-225-RC | Critical Link | MITYDSP-1810F SOM OMAP-L138 | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
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CC-9C-V226-Z6-B | Digi International | MODULE 9C 32MB SDRAM 64MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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20-101-1307 | Digi International | CORE MODULE RCM5760 | MiniCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
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101-0453 | Digi International | MODULE RABBITCORE RCM2300 | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-MX-PF47-ZM-B | Digi International | MOD WI-IMX287 128M FLASH 25/PK | ConnectCard™ | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DC-V-H264-10B-60-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODR 10BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.