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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CENGLH7A400-10-503HC-B | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CC-9C-V212-NC-25 | Digi International | MODULE 9C 16MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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SOMDM3730-11-2783IFCR | Logic PD, Inc. | DM3730 SOM-LV TYPE III 256MB LPD | - | - | - | - | - | - | - | - | - |
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CC-MX-PF58-ZK | Digi International | MOD I.MX287 256MB FLASH | ConnectCard™ | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CENGPXA270-520-10-550HCR | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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TE0782-02-045-2I | Trenz Electronic | SOM SOC Z7045 2XUSB 2XGB ETH 1GB | TE0782 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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SOMDM3730-11-1783IFXR | Logic PD, Inc. | DM3730 SOM-LV TYPE III 256MB LPD | - | - | - | - | - | - | - | - | - |
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CC-9P-V502-MF-B | Digi International | MODULE 9P 8MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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M5475DFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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EC-V-H264-8B-30-1080-MXC-LL | SOC Technologies (System-On-Chip Technologies) | MOD VID ENCODER 8BIT 30FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.