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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
L138-FX-225-RC | Critical Link | MITYDSP-L138 SOM OMAP-L138 | MityDSP-L138 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CC-MX-PF47-KST | Digi International | MODULE CONNECTCORE I.MX287 | ConnectCard™ | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
EZ80F915005MODG | Zilog | MODULE EZ80F91 512K 50MHZ | eZ80® Acclaim!® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CC-MX-LB6B-ZM | Digi International | MODULE I.MX51 2GB FLASH | ConnectCore® | - | - | - | - | - | - | - | - |
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M5475CFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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MOD5270BXX | NXP Semiconductors / Freescale | MOD NETBURNER MOD5270 10 UNITS | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CENGLH7A404-11-402EC | Logic PD, Inc. | CARD ENGINE 32MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0715-04-30-1I3 | Trenz Electronic | XILINX ZYNQ Z-7030 SOC MICROMODU | TE0715 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DC-EM-02T-S | Digi International | EM 8MB SDRAM 4MB FLASH SINGLE | Digi Connect EM® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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SOMOMAP3530-10-1672IFXR | Logic PD, Inc. | SYSTEM ON MODULE LV OMAP3530 | OMAP35x | -20°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.