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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0600-02IVFN | Trenz Electronic | SOM GIGABEE XC6SLX150 2X128MB 3I | TE0600 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-0508 | Digi International | MODULE RABBITCORE RCM3010 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
|
ATSAMA5D27-SOM1 | Micrel / Microchip Technology | SAMA5D2 SYST.ON MODULE 1 | - | -40°C ~ 85°C (TA) | - | - | - | - | - | - | - |
|
TE0725-02-15-1C | Trenz Electronic | SOM ARTIX-7 15T FLASH 1C | TE0725 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CC-MX-MB47-ZM-B | Digi International | MODULE I.MX51 128MB FLASH 25PK | ConnectCore® | - | - | - | - | - | - | - | - |
|
TE0725-02-35-2C | Trenz Electronic | SOM ARTIX-7 XC7A35T-2C FLASH | TE0725 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
CC-9P-T236-Z1 | Digi International | MODULE 9P 64MB SDRAM 64MB FLASH | ConnectCore® | - | - | - | - | - | - | - | - |
|
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20-101-1185 | Digi International | MPU MODULE RABBIT 3000 TWO PACK | RabbitCore® | - | - | - | - | - | - | - | - |
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TE0722-02 | Trenz Electronic | SOM ZYNQ SOFT PROPELLER 40DIP | TE0722 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
20-101-1067 | Digi International | MODULE RABBITCORE RCM3305 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.