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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
- Products
- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CC-9C-V212-Z1 | Digi International | MODULE 9C 16MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0711-01-35-2I | Trenz Electronic | SOM ARTIX-7 HIGH IO 35T USB 2I | TE0711 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-W9M-NA37-XE-B | Digi International | MOD WI-9M 64MB SDRAM 128MB FLASH | ConnectCore® | -40°C ~ 65°C | - | - | - | - | - | - | - |
|
|
20-101-1309 | Digi International | MODULE WI-FI RCM5650W | MiniCore® | -30°C ~ 55°C | - | - | - | - | - | - | - |
|
DC-EM-02T-S-25 | Digi International | EM 8MB SDRAM 4MB FLASH 25 PAK | Digi Connect EM® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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M5475AFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
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CC-9P-V236-Z1 | Digi International | MODULE 9P 64MB SDRAM 64MB FLASH | ConnectCore® | - | - | - | - | - | - | - | - |
|
TE0720-03-1CR | Trenz Electronic | SOM SOC 7Z020-1CLG484C 256MB DDR | TE0720 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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3354-HX-XX7-RC | Critical Link | MOD MITYSOM-3354 | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME-01T-IZU-1 | Digi International | MODULE DIGI CONNECT ME | - | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.