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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SOMDM3730-30-1780AKIR | Logic PD, Inc. | SYSTEM ON MODULE TORP+ DM3730 | DM37x | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0745-02-30-1I | Trenz Electronic | SOM DDR3 1GB ZYNQ XC7Z030-1I | TE0745 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-1068 | Digi International | MODULE RABBITCORE RCM3315 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-SP-01R-C-W | Digi International | ADAPTER SP CUSTOMIZABLE MODEL | Digi Connect SP | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0729-02-2IF | Trenz Electronic | SOM ZYNQ XC7Z020-2I 512MB RTC | TE0729 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0808-04-09EG-2IE | Trenz Electronic | ULTRASOM+ MPSOC-MODUL MIT ZYNQ U | TE0808 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
|
FS-3038 | Digi International | CONNECTCORE 9P | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
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CC-9C-V212-ZA | Digi International | MODULE 9C 16MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0745-01-30-1I | Trenz Electronic | SOM SOC Z7 XC7Z030-1FBG676I 1GB | TE0745 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-0520 | Digi International | MODULE RABBITCORE RCM3200 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.