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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
20-101-0673 | Digi International | MODULE RABBITCORE RCM3610 | RabbitCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
TE0745-02-45-2I | Trenz Electronic | SOM ZYNQ XC7Z045-2I 1GB DDR3 | TE0745 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CENGLH7A400-10-400BC | Logic PD, Inc. | CARD ENGINE 32MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0723-03-07S-1C | Trenz Electronic | SOM ARDUZYNQ ZYNQ Z-7007S | TE0723 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0741-03-325-2CF | Trenz Electronic | SOM KINTEX-7 325T 32MB FLASH AES | TE0741 | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
COMMPC8360E-10-2752FCR | Logic PD, Inc. | KIT 256MB DDR 8MB NOR 64MB NAND | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
TE0741-03-070-2IF | Trenz Electronic | SOM KINTEX-7 70T 32MB FLASH AES | TE0741 | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-MX-KD69-ZM | Digi International | MOD I.MX53 1GHZ 512MB FLASH | ConnectCore® | -20°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-MX-KD69-ZM-B | Digi International | MOD I.MX53 1GHZ 512MB FLASH 25PK | ConnectCore® | -20°C ~ 85°C | - | - | - | - | - | - | - |
|
DC-ME-Y402-C-B | Digi International | ME 9210 8MB SDRAM 4MB FLASH 50PK | Digi Connect ME® | -40°C ~ 80°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.