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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SOMOMAP3503-11-1782GFIR | Logic PD, Inc. | SOM OMAP3530 SOM-LV TY | OMAP35x | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CENGPXA270-416-10-550EIR | Logic PD, Inc. | CARD ENGING 64MB SDRAM | - | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DC-V-H264-8B-30-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD VID DECODER 8BIT 30FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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DC-VA-H264-8B-60-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD A/V DECODER 8BIT 60FPS 264HD | H.264-HD Decoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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SOMAM3703-30-1780AKIR | Logic PD, Inc. | SYSTEM ON MODULE TORP | AM37x | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9M-NA26-Z1 | Digi International | MOD 9M 32MB SDRAM 64MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-9M-NA59-Z1 | Digi International | MOD 9M 256MB SDRAM 512MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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5CSX-H6-42A-RI | Critical Link | MITYSOM-5CSX W/ ALTERA CYCLONE V | MitySOM | -40°C ~ 85°C | - | - | - | - | - | - | - |
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EZ80L925148MODG | Zilog | MCU MODULE 8MB FLASH 100LQFP | eZ80® Acclaim!® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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M53017MOD | NXP Semiconductors / Freescale | MODULE MCF5301 32-BIT VOIP | - | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.