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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
- Products
- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SOMAM1808-10-1602AHCR | Logic PD, Inc. | SYSTEM ON MODULE AM1808 | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-EM-02T-C-25 | Digi International | EM 8MB SDRAM 4MB FLASH 25 PAK | Digi Connect EM® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
|
CC-9P-V526UJ-EA | Digi International | MOD 9P 9215 CONNCORE 8MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CENGLH7A404-11-503HCR-A | Logic PD, Inc. | CARD ENGINE 64MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
DC-ME4-01T-JT | Digi International | MODULE ME CUSTOMIZABLE JTAG | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
CC-MX-LD79-ZK | Digi International | MODULE I.MX53 800MHZ 512MB FLASH | ConnectCore® | -20°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-0961 | Digi International | MODULE RABBITCORE RCM3720 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
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TE0723-02 | Trenz Electronic | SOM ARDUZYNQ 7Z10 USBOTG MICROSD | TE0723 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CC-9P-V513-C | Digi International | MODULE 9P 16MB SDRAM 8MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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SOMDIMM-RX63N | Future Designs, Inc. | DIMM 16MB 10/100 RX63N REV2 | - | - | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.