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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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EC-VA-H264-8B-60-1080-MXC-ZL | SOC Technologies (System-On-Chip Technologies) | MOD A/V ENCODER 8BIT 60FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
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CENGLH7A404-11-402HC | Logic PD, Inc. | CARD ENGINE 32MB SDRAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DC-ME4-01T-DYN-1 | Digi International | MODULE DIGI CONNECT ME | Digi Connect ME® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-MX-LD79-QTC | Digi International | CONNECTCORE | - | - | - | - | - | - | - | - | - |
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TE0725-03-15-1C | Trenz Electronic | SOM ARTIX-7 15T FLASH 1C | TE0725 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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FS-377 | Digi International | MODULE XP 64MB SDRAM 32MB FLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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6711-AA-1X1-RC | Critical Link | MITYDSP SOM TMS320C6711 200MHZ | MityDSP™ | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CENGPXA270-520-10-550HC | Logic PD, Inc. | CARD ENGINE 64MB FLASH 64MB RAM | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CC-MX-PF47-KST-1 | Digi International | MODULE CONNECTCORE I.MX287 | ConnectCard™ | -40°C ~ 85°C | - | - | - | - | - | - | - |
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DLP-HS-FPGA-A | DLP Design, Inc. | MODULE USB-TO-FPGA SPARTAN3 | FPGA | 0°C ~ 70°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.