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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5SGSMD8K3F40C4N | Altera (Intel® Programmable Solutions Group) | IC FPGA 696 I/O 1517FBGA | Stratix® V GS | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP2AGX190FF35C4 | Altera (Intel® Programmable Solutions Group) | IC FPGA 612 I/O 11152FBGA | Arria II GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC6SLX16-3CSG324C | Xilinx | IC FPGA 232 I/O 324CSBGA | Spartan®-6 LX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC7A100T-2CSG324I | Xilinx | IC FPGA ARTIX7 210 I/O 324CSBGA | Artix-7 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| M1AFS1500-2FG676I | Microsemi | IC FPGA 252 I/O 676FBGA | Fusion® | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC6SLX45-L1FGG676I | Xilinx | IC FPGA 358 I/O 676FBGA | Spartan®-6 LX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP4CE6E22I7N | Intel® FPGAs | IC FPGA 91 I/O 144EQFP | Cyclone® IV E | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A1010B-2PLG68I | Microsemi | IC FPGA 57 I/O 68PLCC | ACT™ 1 | -40°C ~ 85°C (TA) | - | - | - | - | - | - | - | |
| XC6SLX45-L1FGG484I | Xilinx | IC FPGA 316 I/O 484FBGA | Spartan®-6 LX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XCVU095-H1FFVB1760E | Xilinx | IC FPGA VIRTEX-U 1760FCBGA | Virtex® UltraScale™ | 0°C ~ 100°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.