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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LFE2-50SE-6FN484I | Lattice Semiconductor | IC FPGA 339 I/O 484FBGA | ECP2 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| LFE2M35E-5F256C | Lattice Semiconductor | IC FPGA 140 I/O 256FBGA | ECP2M | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| M1A3PE1500-1FGG676I | Microsemi | IC FPGA 444 I/O 676FBGA | ProASIC3E | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A42MX24-1PQ160M | Microsemi | IC FPGA 125 I/O 160QFP | MX | -55°C ~ 125°C (TC) | - | - | - | - | - | - | - | |
| A3P030-2QNG48I | Microsemi | IC FPGA 34 I/O 48QFN | ProASIC3 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP2C35F672C8N | Intel® FPGAs | IC FPGA 475 I/O 672FBGA | Cyclone® II | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XCV150-4FG256C | Xilinx | IC FPGA 176 I/O 256FBGA | Virtex® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| M1AFS250-1FG256 | Microsemi | IC FPGA 114 I/O 256FBGA | Fusion® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| 5CEBA7F23C8N | Intel® FPGAs | IC FPGA 240 I/O 484FBGA | Cyclone® V E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFE5U-85F-6BG554C | Lattice Semiconductor | IC FPGA 259 I/O 554CABGA | ECP5 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.