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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A3PN060-1VQ100 | Microsemi | IC FPGA 71 I/O 100VQFP | ProASIC3 nano | -20°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC2VP70-5FFG1704C | Xilinx | IC FPGA 996 I/O 1704FCBGA | Virtex®-II Pro | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| A3P1000L-PQ208I | Microsemi | IC FPGA 154 I/O 208QFP | ProASIC3L | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A3P250L-1FGG256 | Microsemi | IC FPGA 157 I/O 256FBGA | ProASIC3L | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| P1AFS600-2FG256 | Microsemi | IC FPGA 119 I/O 256FBGA | Fusion® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFEC1E-3Q208C | Lattice Semiconductor | IC FPGA 112 I/O 208QFP | EC | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| M1A3P1000-1FGG144M | Microsemi | IC FPGA 97 I/O 144GBGA | ProASIC3 | -55°C ~ 125°C (TJ) | - | - | - | - | - | - | - | |
| A54SX16P-2PQ208I | Microsemi | IC FPGA 175 I/O 208QFP | SX | -40°C ~ 85°C (TA) | - | - | - | - | - | - | - | |
| M7A3P1000-1FGG144I | Microsemi | IC FPGA 97 I/O 144FBGA | ProASIC3 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A3P600-2FGG256I | Microsemi | IC FPGA 177 I/O 256FBGA | ProASIC3 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.