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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XA6SLX9-3CSG225I | 4D Systems | IC FPGA 160 I/O 225CSGBGA | Automotive, AEC-Q100, Spartan®-6 LX XA | -40°C ~ 100°C (TJ) | XA6SLX9-3CSG225I | - | - | - | - | - | - | |
| A40MX02-VQ80M | Microsemi | IC FPGA 57 I/O 80VQFP | MX | -55°C ~ 125°C (TC) | - | - | - | - | - | - | - | |
| LFE2-6SE-5FN256C | Lattice Semiconductor | IC FPGA 190 I/O 256FBGA | ECP2 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC3S250E-4TQ144C | Xilinx | IC FPGA 108 I/O 144TQFP | Spartan®-3E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP20K200BC356-1X | Altera (Intel® Programmable Solutions Group) | IC FPGA 277 I/O 356BGA | APEX-20K® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LCMXO2280C-4TN144C | Lattice Semiconductor | IC FPGA 113 I/O 144TQFP | MachXO | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| A14V100A-RQ208C | Microsemi | IC FPGA 175 I/O 208QFP | ACT™ 3 | 0°C ~ 70°C (TA) | - | - | - | - | - | - | - | |
| EP4SE360F35I4N | Altera (Intel® Programmable Solutions Group) | IC FPGA 744 I/O 1152FBGA | STRATIX® IV E | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XCS30-4TQ144C | Xilinx | IC FPGA 113 I/O 144TQFP | Spartan® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP4CE10F17A7N | Intel® FPGAs | IC FPGA 179 I/O 256FBGA | Cyclone® IV E | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.