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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2GL050T-1VF400 | Microsemi | IC FPGA 207 I/O 400VFBGA | IGLOO2 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XQ6SLX150T-DIE0628 | 4D Systems | IC FPGA SPARTAN 6 147K DIE | Spartan®-6 Q LXT | -40°C ~ 125°C (TJ) | XQ6SLX150T-DIE0628 | - | - | - | - | - | - | |
| LFEC10E-5QN208C | Lattice Semiconductor | IC FPGA 147 I/O 208QFP | EC | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XCKU3P-3SFVB784E | Xilinx | XCKU3P-3SFVB784E | Kintex® UltraScale+™ | 0°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XA6SLX45T-3FGG484I | Xilinx | IC FPGA 296 I/O 484FBGA | Automotive, AEC-Q100, Spartan®-6 LXT XA | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC4052XL-09BG560C | Xilinx | IC FPGA 352 I/O 560MBGA | XC4000E/X | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| 5SGSMD3H2F35I3N | Altera (Intel® Programmable Solutions Group) | IC FPGA 432 I/O 1152FBGA | Stratix® V GS | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| M1A3P600-PQG208I | Microsemi | IC FPGA 154 I/O 208QFP | ProASIC3 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XCKU115-2FLVA2104E | Xilinx | IC FPGA 832 I/O 2104FCBGA | Kintex® UltraScale™ | 0°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP1SGX25DF672C6 | Intel® FPGAs | IC FPGA 455 I/O 672FBGA | Stratix® GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.