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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EP4CE22F17C8LN | Altera (Intel® Programmable Solutions Group) | IC FPGA 153 I/O 256FBGA | Cyclone® IV E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC6VLX75T-2FFV484C | 4D Systems | IC FPGA 240 I/O 484FCBGA | Virtex®-6 LXT | 0°C ~ 85°C (TJ) | XC6VLX75T-2FFV484C | - | - | - | - | - | - | |
| A3PN060-Z1VQG100I | Microsemi | IC FPGA 71 I/O 100VQFP | ProASIC3 nano | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP2AGX95EF29I3 | Altera (Intel® Programmable Solutions Group) | IC FPGA 372 I/O 780FBGA | Arria II GX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| M1AGL250V5-FGG144I | Microsemi | IC FPGA 97 I/O 144FBGA | IGLOO | -40°C ~ 85°C (TA) | - | - | - | - | - | - | - | |
| XCKU15P-1FFVE1517I | Xilinx | XCKU15P-1FFVE1517I | Kintex® UltraScale+™ | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A54SX16P-PQG208 | Microsemi | IC FPGA 175 I/O 208QFP | SX | 0°C ~ 70°C (TA) | - | - | - | - | - | - | - | |
| AT40K20-2FQC | Micrel / Microchip Technology | IC FPGA 20K GATES 304PQFP | AT40K/KLV | 0°C ~ 70°C | - | - | - | - | - | - | - | |
| XCVU5P-1FLVA2104E | Xilinx | XCVU5P-1FLVA2104E | Virtex® UltraScale+™ | 0°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| LFE2M50E-7FN900C | Lattice Semiconductor | IC FPGA 410 I/O 900FBGA | ECP2M | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.