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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M1AFS250-1FG256I | Microsemi | IC FPGA 114 I/O 256FBGA | Fusion® | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| AGL1000V5-FG144I | Microsemi | IC FPGA 97 I/O 144FBGA | IGLOO | -40°C ~ 85°C (TA) | - | - | - | - | - | - | - | |
| XC5VLX220T-2FF1738I | Xilinx | IC FPGA 680 I/O 1738FCBGA | Virtex®-5 LXT | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC2S50-6PQ208C | Xilinx | IC FPGA 140 I/O 208QFP | Spartan®-II | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| A3PE3000-FG484I | Microsemi | IC FPGA 341 I/O 484FBGA | ProASIC3E | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A3P1000-FGG484I | Microsemi | IC FPGA 300 I/O 484FBGA | ProASIC3 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP1C3T144C6N | Intel® FPGAs | IC FPGA 104 I/O 144TQFP | Cyclone® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XCV600E-6BG560I | Xilinx | IC FPGA 404 I/O 560MBGA | Virtex®-E | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| LAE3-17EA-6LFN484E | Lattice Semiconductor | IC FPGA 222 I/O 484FBGA | LA-ECP3 | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | |
| XC3S500E-5CPG132C | Xilinx | IC FPGA 92 I/O 132CSBGA | Spartan®-3E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.