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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A3P600L-FG484 | Microsemi | IC FPGA 235 I/O 484FBGA | ProASIC3L | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFEC33E-4FN484C | Lattice Semiconductor | IC FPGA 360 I/O 484FBGA | EC | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP3SE260H780C4N | Altera (Intel® Programmable Solutions Group) | IC FPGA 488 I/O 780HBGA | Stratix® III E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFE3-150EA-6FN672ITW | Lattice Semiconductor | IC FPGA 380 I/O 672FBGA | ECP3 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| ICE5LP1K-CM36ITR1K | Lattice Semiconductor | IC FPGA 26 I/O 36UCFBGA | iCE40 Ultra™ | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP3SE80F1152C4N | Intel® FPGAs | IC FPGA 744 I/O 1152FBGA | Stratix® III E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC2V250-5FGG456C | Xilinx | IC FPGA 200 I/O 456FBGA | Virtex®-II | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC4028XL-1HQ304I | Xilinx | IC FPGA 256 I/O 304HQFP | XC4000E/X | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A3PE600-PQG208 | Microsemi | IC FPGA 147 I/O 208QFP | ProASIC3E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| 5SGXMB5R2F40C2N | Altera (Intel® Programmable Solutions Group) | IC FPGA 432 I/O 1517FBGA | Stratix® V GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.